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! Note ? Please read rating and ! CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
? This catalog has only typical speci?cations. Therefore, please approve our product speci?cations or transact the approval sheet for product speci?cations before ordering.
Notice
Continued from the preceding page.
2. Land Dimensions
C03E.pdf
May.17,2013
2-1. Chip capacitors can be cracked due to the stress of
PCB bending, etc. if the land area is larger than
needed and has an excess amount of solder.
Please refer to the land dimensions in table 1 for flow
soldering, table 2 for reflow soldering.
c
Chip Capacitor
Land
Please confirm the suitable land dimension by
b
a
Solder Resist
evaluating of the actual SET / PCB.
Table 1 Flow Soldering Method
Part Number
Dimensions
Chip (L g W)
a
b
c
GC3/GCD/GCM/GCJ18
(Rated Voltage: above 250VDC (for GCJ18 alone))
GC3/GCD/GCM/GCJ21
(Rated Voltage: above 250VDC (for GCJ21 alone))
GC3/GCD/GCM/GCJ31
(Rated Voltage: above 250VDC (for GCJ31 alone))
1.6 g 0.8
2.0 g 1.25
3.2 g 1.6
0.6 to 1.0
1.0 to 1.2
2.2 to 2.6
0.8 to 0.9
0.9 to 1.0
1.0 to 1.1
0.6 to 0.8
0.8 to 1.1
1.0 to 1.4
Flow soldering can only be used for products with a chip size of 3.2x1.6mm or less.
Table 2 Reflow Soldering Method
(in mm)
Part Number
Dimensions
Chip (L g W)
a
b
c
GC3/GCD/GCE/GCJ/GCM03
GC3/GCD/GCE/GCJ/GCM15
GC3/GCD/GCE/GCJ/GCM18
GC3/GCD/GCE/GCJ/GCM21
GC3/GCD/GCE/GCJ/GCM31
GC3/GCD/GCE/GCJ/GCM32
GC3/GCD/GCE/GCJ/GCM43
GC3/GCD/GCE/GCJ/GCM55
0.6 g 0.3
1.0 g 0.5
1.6 g 0.8
2.0 g 1.25
3.2 g 1.6
3.2 g 2.5
4.5 g 3.2
5.7 g 5.0
0.2 to 0.3
0.3 to 0.5
0.6 to 0.8
1.0 to 1.2
2.2 to 2.4
2.0 to 2.4
3.0 to 3.5
4.0 to 4.6
0.2 to 0.35
0.35 to 0.45
0.6 to 0.7
0.6 to 0.7
0.8 to 0.9
1.0 to 1.2
1.2 to 1.4
1.4 to 1.6
0.2 to 0.4
0.4 to 0.6
0.6 to 0.8
0.8 to 1.1
1.0 to 1.4
1.8 to 2.3
2.3 to 3.0
3.5 to 4.8
(in mm)
<Applicable to Part Number KC3/KCM>
Part Number
KC3/KCM55
Dimensions
Chip (L g W)
5.7 g 5.0
a
2.6
b
2.7
c
5.6
(in mm)
2. Adhesive Application
1. Thin or insufficient adhesive can cause the chips to
loosen or become disconnected during flow soldering.
a=20 to 70μm
The amount of adhesive must be more than dimension c,
shown in the drawing at right, to obtain the correct
bonding strength.
The chip's electrode thickness and land thickness must
Chip Capacitor
Adhesive
b=30 to 35μm
c=50 to 105μm
a
c
b
also be taken into consideration.
2. Low viscosity adhesive can cause chips to slip after
mounting. The adhesive must have a viscosity of
5000Pa s (500ps) min. (at 25°C).
3. Adhesive Coverage
Size (L g W)
Adhesive Coverage*
1.6 g 0.8
0.05mg min.
2.0 g 1.25
0.1mg min.
3.2 g 1.6
0.15mg min.
Board
Land
*Nominal Value
Continued on the following page.
58
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